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Drill small holes in sapphie/ micro drilling of sapphire
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Categories: Applications » Electronics Industry »
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Description:
description:micro drilling of sapphire with laser machine.The sapphire substrate can be provided according to your specific requirements.
Min hole size: 30micron
Max thickness: 1mm
Max depth-diameter ratio: 20:1
Hole precision: 5micron
Smooth sidewall, no chipping, no burs
Taper adjustable
our company provide laser precision machining for ceramics cutting and drilling,and our laser server has many advatage:high quality,good edge effects,small thermal effects and so on.
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Related Category: Applications » Electronics Industry »
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