Laser drilling in silicon substrate

Hole diameter: 0.4mm

Material thickness: 0.4mm

Tact time: 20s/hole

Compared with the traditional techniques, laser  delivers excellent performance with more efficiency, higher precision. Additionally, the special dusting system avoids the secondary pollution of the traditional sand blast process.  

our laser system has a lot of benefits

Applicability to a wide range of materials and thickness  

Narrow kerf widths

High speeds

Very high repeatability

Very high reliability

Easily automated and programmable