We are professional Applications factory and supplier in China.We can produce Applications according to your requirements.More types of Applications wanted,please contact us right now!
View: 
Description: Precision dicing of silicon wafer Cutting edge quality
Description: Laser precision grooving of alloy.For feasibility study and process development of high-efficiency photovoltaic cells manufacturing, such as laser doping, grooving, EWT, MWT, LFC, etc.
Description:Silicon cutting with UV laser,0.4mm thcikness.Laser precision cutting is an attractive micromachining technique for most materials,such as alloy,stainless steel,glass,ceramics,thin film and so on.
