LED Industry

The new generation of laser scribing machine (model-gms 50 lamp pumped) is capable of scribing various silicon wafer,solar cell,ceramic wafer,thin metal sheet (~0. 5 mm thick maximum), etc.in industries of electronics,semiconductor and solar energy,etc.

Description: Precision drilling in sapphire wafer

LGP is a transparent acrylic panel made from pure PMMA resin, on whose bottom face a dot matrix is printed or a line matrix is scratched.conpare with tradtion ways,we used the new technology,laser etching.it has a lot of advantage.

Laser dicing on copper LED wafer,our company offering advanced Laser dicing Services. Customer focused and with highly skilled staff, we are ready to assist you with your fabrication and manufacturing projects using our advanced laser cutting services.

description:customizd sapphire wafe,sapphire substrate, sapphire windows,we could provide unusual size as customers' require. not only these,but we also could do drilling,groving and scribing on the material.

description: provide optical glass,cover windows,and optical filter as customers' require.our company provide laser precision machining for ceramics cutting and drilling,and our laser server has many advatage:high quality,good edge effects,small thermal effects and so on.

description:Ceramics support/ ceramics substrate/ aluminium circuit substrate with laser machine.our company provide laser precision machining for ceramics cutting and drilling,and our laser server has many advatage:high quality,good edge effects,small thermal effects and so on.

description:crystalline silicon circuit board drilling.keywords:crystalline silicon circuit board drilling/Silicon substrate LED drilling.dli laser has the capability to drill precision microholes as small as 1 um with submicron positional tolerances in a variety of materials such as plastics (polymers), metals, ceramics and glass.