Applications
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The new generation of laser scribing machine (model-gms 50 lamp pumped) is capable of scribing various silicon wafer,solar cell,ceramic wafer,thin metal sheet (~0. 5 mm thick maximum), etc.in industries of electronics,semiconductor and solar energy,etc.
Description:our laser system with automatic CCD positioning system,automatic loading and unloading system (optional),efficient dust removal system,automatic temperature control system,convenient control system.
Description: Laser precision etching of chrome coating on glass substrate,capable to any kind of partterns with high resolution��our company has the most advanced laser source,and provide the most comprehensive laser service. such as laser cutting,laser scribing,laser ablation and so on.
Description: : Precision laser drilling hole by hole with good edge quality.laser drilling has a lot of advantege, such as non-contact process (no tooling wear or breakage, minimal material distortion),highly accurate and consistent results.
Description: laser application of glass.Laser drilling in borosilicate glass, hole by hole.not only Straight holes,but also Blind hole we could do.and we also do laser cutting in all kind of glass with good edge quality.
Description: Lasers make it possible to machine very small, blind, unusually shaped and precisely tapered holes. They can drill holes at steep angles and process difficult-to-machine materials. A single set-up can produce hundreds of different sizes over a 3D surface.
Description:the material is brass with 2mm,and apply to flow control.High deep-diameter ratiothe hole diameter is 70micron.and the diameter we could do from 10um to 6mm.not only metal,but alloy,glass,cearmics,thin film and so on.
Description:Laser drilling in glass
Description: Almost any type of material can be micro-cut. Materials which can be machined include: stainless steel, hardened steel, copper, aluminium, brass, tungsten, titanium,alumina, zirconia, machinable ceramics, green ceramics, PZT, silicon nitride, tungsten carbide.
Description:precision drilling in silicon wafer with laser system,in high edge quality ,high precision and pollution-free,and without chipping.we do the process according to customers' requirements.
Description: Laser drilling in PVC thin films .Apply to electronics industry.our laser system has high quality in cutting edge and high stability and precision.we could do the process as customer required.
Description: micro slots cutting in ceramics. the max thickness:2mm .our laser system is in high quality, better than common cutting. the laser cutting can be for various meteral,such as ceramics,glass,stainless steel and so on.
Description:: Laser cutting of Wafer bonding.our laser system has high quality in cutting edge and high stability and precision.we could do the process as customer required.
Description:Glass cutting and drilling with high power laser. Equipped with high power DPSS laser or CO2 laser, it is a ideal tool of scribing, cutting and drilling in glass mainly apply for display and semiconductor industries.
Description: Laser precision cutting of metal.Cost-effective and efficient cutting tool of many materials, especially for thin metal sheet, mainly apply to precise cutting of stent, battery electrodes, etc.
Description: Thin stainless steel micro cutting with ultra-fast laser.Cost-effective and efficient cutting tool of many materials, especially for thin metal sheet, mainly apply to precise cutting of stent, battery electrodes, etc.
Description:Blind hole ablation with ultra-fast laser.the laser system also could do cutting, drilling and surface treatment.mainly Located in the processing glass, ceramics,aspphire,silicon various alloys and so on.
Description: Laser precision grooving of alloy.For feasibility study and process development of high-efficiency photovoltaic cells manufacturing, such as laser doping, grooving, EWT, MWT, LFC, etc.
Description:our laser system is developed with international prevalent modularization design and its key components are all imported high-quality ones. It has gained customers�� acknowledgement and authorization.
Description:Aluminum coating etching with UV laser Quartz substrate
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