R&D Projects
Total 4 Products
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Description: Thin stainless steel micro cutting with ultra-fast laser.Cost-effective and efficient cutting tool of many materials, especially for thin metal sheet, mainly apply to precise cutting of stent, battery electrodes, etc.
Description:Blind hole ablation with ultra-fast laser.the laser system also could do cutting, drilling and surface treatment.mainly Located in the processing glass, ceramics,aspphire,silicon various alloys and so on.
Description: Laser precision grooving of alloy.For feasibility study and process development of high-efficiency photovoltaic cells manufacturing, such as laser doping, grooving, EWT, MWT, LFC, etc.
sapphire slice drilling with picosecond laser machine,it is different from normal laser dirlling,form the pirture,you can see that there is no thermal effects in the edge.the picosecond laser machine is the most advanced laser machine in the world.
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