description:stealth dicing with high end laser machine,and we used a specially technelogy to do the dicing. we did not destroy the material external,and only dice the inside.it is the latest technolegy in the world now.

the chip coated with thin film,processed with high end laser machine. our company has the most advanced laser source,and provide the most comprehensive laser micro manufacturing. such as laser cutting,laser scribing,laser ablation and so on.

Precision dicing of silicon wafer.Apply to 8’’ silicon wafer dicing for semiconductor industry. our laser system has a lot of features； High precision: a precise cutting for various precision parts, arts and crafts. Small heat affected zone, good dimension stability. Flat and handsome laser-slotted, without later process