Ceramics Wafer Drilling

material thickness: 0.5mm

Hole diameter: 0.5mm

mainly apply to LED, electronics, semiconductors industries.

Deli Laser Solutions owns an experienced team of process development and management, and over 30 sets advanced UV lasers, ultra-fast lasers, fiber lasers, CO2 lasers,as well as complete and sophisticated test machines, including 3D microscope, laser interferometer, measuring arms, IR Imager, Laser Beam Profiler, etc.

With advanced laser manufacturing technologies, rich experiences of process development and professional management, Deli Laser Solutions is devoted to customized, cost-effective and complete laser solutions,from process development, feasibility study, job order production to mass manufacturing outsourcing.