Laser cutting of alumina substrate for thick-film circuit

 description:Laser cutting of alumina substrate for thick-film circuit.

keywords:thick film circuit/thick film integrated circuit/line cutting circuit board

Application : electronic

Max thickness: 1mm
Max processing size: 500 * 500mm
Accuracy: 0.005mm
Lines of high precision, with the excellent edge effect.
Deli laser Solutions is dedicated to producing only the highest quality products. We want to ensure that any substrates supplied by deli laser Solutions fully meet your performace expectations. In order to meet this goal, we provide a strong technolegy team. 
Deli laser Solutions fully supports all markets including: industrial, medical, military, and aerospace. We can handle volumes from small prototype runs to full production at competitive prices. We hope to work with you on your next thick film substrate or hybrid requirement.