sapphire drilling

 Precision drilling in sapphire wafer

Material thickness: 0.25mm

Hole diameter: 200micron

Reference

D=0.5mm hole in 0.64mm thick sapphire

Deli Laser Solutions owns an experienced team of process development and management, and over 30 sets advanced UV lasers, ultra-fast lasers, fiber lasers, CO2 lasers,as well as complete and sophisticated test machines, including 3D microscope, laser interferometer, measuring arms, IR Imager, Laser Beam Profiler, etc.