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The name:
Silicon drilling
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Categories: Solutions » Laser Drilling »
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Description:
Laser drilling in silicon substrate
Hole diameter: 0.4mm
Material thickness: 0.4mm
Tact time: 20s/hole
Compared with the traditional techniques, laser delivers excellent performance with more efficiency, higher precision. Additionally, the special dusting system avoids the secondary pollution of the traditional sand blast process.
our laser system has a lot of benefits
Applicability to a wide range of materials and thickness
Narrow kerf widths
High speeds
Very high repeatability
Very high reliability
Easily automated and programmable
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Related Category: Solutions » Laser Drilling »
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