Products
Thin silicon wafer cutting/scribing/drilling/perforating
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ProductName
Thin silicon wafer cutting/scribing/drilling/perforating
Model:
Categories: Semiconductors Industry
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Description:
Material thickness: less than 400um
Max wafer size: 12inch
Scribing width less than 20um,
Cutting street width low to 50um
Customized size and design
Previous Product:Ferrite substrate/ custom ferrite plate/ Ferroelectrics plate
Next Product:Silicon Wafer Dicing
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