Wafer bonding mirco cutting

 Laser cutting of Wafer bonding

0.5mmGlass + 0.24mmSilicon

1. High precision: Precise cutting for various precision part, arts and crafts.
2. Small heat affected zone, good dimension stability. Smooth and beautiful cutting edges or surface do not need later processing.
3. Higher cutting speed and low cost.

4 Almost all kinds of metals can be laser cut: mild steel, stainless steel and aluminum are the most common applications. Other laser cut parts are made from wood, plastics, glass and ceramics.

Laser cutting is a perfect match for working with a wide range of applications. High speed and clean edges are important for these applications. DeliLaser solutions offer a fast, safe, and easy way to cut with smooth and precise edges, even for the most complex shapes and sizes.