Description: laser application of glass.Laser drilling in borosilicate glass, hole by hole.not only Straight holes,but also Blind hole we could do.and we also do laser cutting in all kind of glass with good edge quality.

Description: Lasers make it possible to machine very small, blind, unusually shaped and precisely tapered holes. They can drill holes at steep angles and process difficult-to-machine materials. A single set-up can produce hundreds of different sizes over a 3D surface.

description:Ceramic substrate scribing.In hybrid technology it is often necessary to scribe and break out the large area substrates according to the size of the individual circuits. For vias and for special profiles the substrates have to be drilled and cut.