laser manufacturing for PCB drilling
description:laser drillin in cermics.
the thickness which we could maching:
glass,below 6mm
other material, metal,cerimics,silicon,sapphire,thin film and so on ,below 1mm.
the smallest dlameter of hole:5um.
Almost any type of material can be drillen Materials which can be machined include:
�� metals: stainless steel, hardened steel, copper, aluminium, brass, tungsten, titanium
�� ceramics: alumina, zirconia, machinable ceramics, green ceramics, PZT, silicon nitride, tungsten carbide
�� super hard materials: diamond, silicon nitride, tungsten carbide
�� plastics: polyimide, PTFE, PMMA, Kapton, Vespel, Cirlex, ABS
�� glasses and crystaline materials: BK7, sapphire, fused silica
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