laser manufacturing for PCB drilling

description:laser drillin in cermics.

the thickness which we could maching:

                                                                    glass,below 6mm

                                                                other material, metal,cerimics,silicon,sapphire,thin film and so on ,below 1mm.

the smallest dlameter of hole:5um.

Almost any type of material can be drillen  Materials which can be machined include:

· metals: stainless steel, hardened steel, copper, aluminium, brass, tungsten, titanium

· ceramics: alumina, zirconia, machinable ceramics, green ceramics, PZT, silicon nitride, tungsten carbide

· super hard materials: diamond, silicon nitride, tungsten carbide

· plastics: polyimide, PTFE, PMMA, Kapton, Vespel, Cirlex, ABS

· glasses and crystaline materials: BK7, sapphire, fused silica