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Description: Laser etching of Aluminum coating,Glass substrate,
Description:a-Si, CdTe, CIGS solar cell scribing, complete solutions for P1,P2,P3, for 24/7 manufacturing.
A type of high-precision processing equipment which is specially designed for wafer sawing, and it is mainly applied to the scribing and cutting of sapphire substrate GaN wafer. this machine does a good job in the scribing and cutting of the wafer whose substrate material is copper,cobalt,cunico,molybdenum,etc.
