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The name:
Micro grooves in glass/ceramics/quartz/sapphire
Model:
Categories: Applications » Semiconductors Industry »
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Description:
Min precision of +/-5micron
Max size: 500*500mm
Min slot width: 10micron
Max depth-width ratio of micro holes: 10:1
Material thickness: 0.01mm~1mm
No burs, no thermal effect zoon, good quality consistency
We could also provide the micro slots cut plate of any metal and many nonmetal materials
Deli Laser Solutions has rich experience in laser groving ,and the quality is widely recognized.
description:stealth dicing with high end laser machine,and we used a specially technelogy to do the dicing. we did not destroy the material external,and only dice the inside.it is the latest technolegy in the world now.
Previous Product:Silicon Wafer Dicing
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Related Category: Applications » Semiconductors Industry »
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