Precision dicing of silicon wafer.Apply to 8’’ silicon wafer dicing for semiconductor industry. our laser system has a lot of features； High precision: a precise cutting for various precision parts, arts and crafts. Small heat affected zone, good dimension stability. Flat and handsome laser-slotted, without later process

0.4mm Silicon substarte drilling.With high power laser and specially designed dust collecting system, the equipment delivers excellent performance with more efficiency, no pollution, higher precision, and no damage to the substrate.

Laser drilling in crystalline silicon solar cell(MWT).For feasibility study and process development of high-efficiency photovoltaic cells manufacturing, such as laser doping, grooving, EWT, MWT, LFC, etc.