Laser cutting of Wafer bonding with hgih efficiency,high degree of repeatability and fitting accuracyand precision. many different materials (Polystyrene, Cardboard, Plywood, MDF, Balsa wood, Acrylic, etc )could processed by laser system.

Thick Glass Cutting Machine is used for offline cutting of glasses in various shapes and sizes.The machine comprises of glass loading table,a set of fixed diamond cutters and a set of movable diamond cutters.The pitch distance between the diamond cutters defines the shape and size of the glass pieces.

Trepanning cutting in 0.6mm ceramics with laser system,in high quality,small heat affected zone. the laser system has high cutting speed and low cost.our company has the most advanced laser source,and provide the most comprehensive laser service. such as laser cutting,laser scribing,laser ablation and so on.