Laser Drilling,Laser Cutting,Laser Micromachining,
Total 197 Products
We are professional Laser Drilling,Laser Cutting,Laser Micromachining factory and supplier in China.We can produce Laser Drilling,Laser Cutting,Laser Micromachining
according to your requirements.More types of Laser Drilling,Laser Cutting,Laser Micromachining wanted,please contact us right now!
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Description: Laser drilling in stainless steel with precision dimension control.We are OEM supplier, your inquiry with drawing or sample will receive our prompt attention.
Description: Laser micromachining in sapphire,all kind of holes can be processd,such as straight holes,taper holes and so on. laser drilling is has many advantage, high pricision, good edge quality,and small affected zone.
Description:Laser drilling in crystalline silicon solar cell(MWT)
Description: Precise drilling for various precision part, arts and crafts. laser drilling with small heat affected zone, good dimension stability,smooth and beautiful cutting edges or surface do not need later processing.
Description: Laser precision machining in PVC thin films.Compared with the traditional techniques, laser drilling delivers excellent performance with more efficiency, higher precision. Additionally, the special dusting system avoids the secondary pollution of the traditional sand blast process.
Description: micro slots cutting in ceramics with UV laser.our company provide laser precision machining for ceramics cutting and drilling,and our laser server has many advatage:high quality,good edge effects,small thermal effects and so on.
Description: ceramics cutting,laser cutting has a lot of advantage, such as high precision, small heat affected zone, good dimension stability. Smooth and beautiful cutting edges or surface do not need later processing.
Description: our laser system used in glass, ceramics, quartz, diamond, boron nitrate and other transparent high-hardness and brittle wafer substrate, also used in copper, cobalt, steel, cobalt alloys, molybdenum and other metals. Mainly used in semiconductor, LED chip manufacturing and othe high-tech industries.
Description:High cutting precision suitabIe for cutting aII kinds of glass,ceramics and thin stainless steel,the MAX of the material thickness is 10mm, and the edge affect is better than The traditional way.
Description: laser micro drilling of brass.our company has the most advanced laser source,and provide the most comprehensive laser service. such as laser cutting,laser scribing,laser ablation and so on.
Description:Precision thin stainless steel cutting.Laser cutting is high power density ,better controlled no-contact processing.Small heat affected zone,good dimension stability.Flat and handsome laser-slotted without later process.
Description: Laser machine cutting metal sheets computerized imagine shapeused to cut stainless steel,brass,aluminum,titianium,carbon steel.We are committed to provide high quality products at competitive price according to your drawings and print.
Description: Thin stainless steel micro cutting with ultra-fast laser.We provide the processing of precision parts of stainless steel, copper, iron, aluminum and other kinds of materials. We are equipped with first-class processing and testing equipment to ensure product accuracy and quality.
Description: Precision laser cutting of sapphire. Be widely used in cutting stainless steel, carbon steel, alloy steel, spring steel, aluminum, copper, silver, glass,ceramics,and other materials below 6mm.
Description:Almost all kinds of metals can be laser cut: mild steel, stainless steel and aluminum are the most common applications. Other laser cut parts are made from wood, plastics, glass and ceramics,and silicon micro cutting we do very well.
We are providing various sorts of Silicon Wafers and substrates like silicon sapphire,GaAs,Quartz and ETC Wafer (glass, Single Crystal).These have been developed with the help of top notch processes.We store them in adequate conditions and pack them in excellent materials.
Description: Laser doping of silicion.Deli Laser Solutions has rich experience in laser doping ,and the quality is widely recognized. Customer focused and with highly skilled staff, we are ready to assist you with your fabrication and manufacturing projects using our advanced laser cutting services.
silicon wafer precision laser dicing with UV laser,our company has the most advanced laser source,and provide the most comprehensive laser service. such as laser cutting,laser scribing,laser ablation,fine cut laser dicingand so on.
the cellscribe system wavelength is 1064nm or 532nm or 355nm.it used in a-si/u-si·CIGS·CdTe,the scribing format 1100 x 1400mm (standard ),scribing line width of 30 - 250μm,The carved speed ≦ 1200mm / s.
A type of high-precision processing equipment which is specially designed for wafer sawing, and it is mainly applied to the scribing and cutting of sapphire substrate GaN wafer. this machine does a good job in the scribing and cutting of the wafer whose substrate material is copper,cobalt,cunico,molybdenum,etc.
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